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Bisphenol/Diamine Curable Terpolymer


PessCure 10 min @ 17℃;PostCure: 24 h @ 230℃ (Bisphenen Cure Sstem);4h @ 230℃ (Peroxide Cure System)

KR325: suitable for compression, transfer, injection molding, it has high chemical resistance.

KR370: suitable for compression molding, it has high chemical resistance and long-term thermal characteristics.


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